Yanhong Tian: шукати на сайті Z-Library

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

Про збір коштів Детальніше

Підтримати

Книги
Статті (451)
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Wind power prediction method based on hybrid kernel function support vector machine

Tian, Zhongda, Li, Shujiang, Wang, Yanhong, Wang, Xiangdong

Журнал:

Wind Engineering

Рік:

2017

Мова:

english

Файл:

PDF, 1.49 MB

english, 2017

Mixed-kernel least square support vector machine predictive control based on improved free search algorithm for nonlinear systems

Zhongda, Tian, Shujiang, Li, Yanhong, Wang, Xiangdong, Wang

Журнал:

Transactions of the Institute of Measurement and Control

Рік:

2018

Мова:

english

Файл:

PDF, 1.50 MB

english, 2018

Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining

Wang, Shang, Tian, Yanhong, Hang, Chunjin, Wang, Chenxi

Журнал:

Scientific Reports

Рік:

2018

Мова:

english

Файл:

PDF, 4.82 MB

english, 2018

Growth of few-layer graphene on SiC at low temperature with the fluorocarbon plasma pre-etching

Xu, Yijun, Wu, Xuemei, Ye, Chao, Deng, Yanhong, Chen, Tian, Ge, Shuibing

Журнал:

Thin Solid Films

Рік:

2013

Мова:

english

Файл:

PDF, 462 KB

english, 2013

Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints

An, Rong, Tian, Yanhong, Zhang, Rui, Wang, Chunqing

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2015

Мова:

english

Файл:

PDF, 1.43 MB

english, 2015

Effect of Au-Sn IMCs’ formation and morphologies on shear properties of laser reflowed micro-solder joints

Liu, Wei, An, Rong, Wang, Chunqing, Tian, Yanhong

Журнал:

Soldering & Surface Mount Technology

Рік:

2015

Мова:

english

Файл:

PDF, 754 KB

english, 2015

Oxidation and Au‐Sn reaction of laser reflowed micro‐solder joints protected by N2 or exposed to air atmosphere

Liu, Wei, Tian, Yanhong, Yang, Lei, Wang, Chunqing, Sun, Lining

Журнал:

Soldering & Surface Mount Technology

Рік:

2012

Мова:

english

Файл:

PDF, 431 KB

english, 2012

Contribution of interspecific interactions and phosphorus application to increasing soil phosphorus availability in relay intercropping systems

Wang, Xiaochun, Deng, Xiaoyan, Pu, Tian, Song, Chun, Yong, Taiwen, Yang, Feng, Sun, Xin, Liu, Weiguo, Yan, Yanhong, Du, Junbo, Liu, Jiang, Su, Kai, Yang, Wenyu

Журнал:

Field Crops Research

Рік:

2017

Мова:

english

Файл:

PDF, 1.89 MB

english, 2017

Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Liu, Wei, An, Rong, Wang, Chunqing, Zheng, Zhen, Tian, Yanhong, Xu, Ronglin, Wang, Zhongtao

Журнал:

Micromachines

Рік:

2018

Мова:

english

Файл:

PDF, 3.12 MB

english, 2018

The Multi-Objective Optimization Model of Flue Aimed Temperature of Coke Oven

Tian, Zhongda, Li, Shujiang, Wang, Yanhong

Журнал:

JOURNAL OF CHEMICAL ENGINEERING OF JAPAN

Рік:

2018

Мова:

english

Файл:

PDF, 1.42 MB

english, 2018

The real-time determination of D- and L-Lactate based on optical weak measurement

Qiao, Zhen, Shi, Lixuan, Guan, Tian, Xu, Yang, Guo, Cuixia, Li, Dongmei, He, Yonghong, Ji, Yanhong

Журнал:

Analytical Methods

Рік:

2019

Мова:

english

Файл:

PDF, 815 KB

english, 2019

SpyTag/SpyCatcher cyclization enhances the thermostability and organic solvent tolerance of l-phenylalanine aldolase

Wang, Yida, Tian, Junwei, Xiao, Ying, Wang, Yue, Sun, Hongxu, Chang, Yanhong, Luo, Hui

Журнал:

Biotechnology Letters

Рік:

2019

Мова:

english

Файл:

PDF, 1.02 MB

english, 2019

The methylation of aromatic nuclei — I: Implications for the geochemical evolution of gas

Liu, Yanhong, Wu, Yingqin, Xia, Yanqing, Xing, Lantian, Tian, Chuntao, Lei, Tianzhu

Журнал:

International Journal of Coal Geology

Рік:

2019

Мова:

english

Файл:

PDF, 3.13 MB

english, 2019

Comprehensive exploration of the ultraviolet degradation of polychlorinated biphenyls in different media

Huang, Chenchen, Zeng, Yanhong, Luo, Xiaojun, Ren, Zihe, Tian, Yankuan, Mai, Bixian

Журнал:

Science of The Total Environment

Рік:

2021

Файл:

PDF, 1.18 MB

2021

Development and evaluation of rapid detection of classical swine fever virus by reverse transcription loop-mediated isothermal amplification (RT-LAMP)

Shuanghui Yin, Youjun Shang, Guangqing Zhou, Hong Tian, Yanhong Liu, Xuepeng Cai, Xiangtao Liu

Журнал:

Journal of Biotechnology

Рік:

2010

Мова:

english

Файл:

PDF, 238 KB

english, 2010

Finite element modeling of electron beam welding of a large complex Al alloy structure by parallel computations

Yanhong Tian, Chunqing Wang, Danyang Zhu, Y. Zhou

Журнал:

Journal of Materials Processing Technology

Рік:

2008

Мова:

english

Файл:

PDF, 1.61 MB

english, 2008

Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature

Yanhong Tian, Chunqing Wang, Ivan Lum, M. Mayer, J.P. Jung, Y. Zhou

Журнал:

Journal of Materials Processing Technology

Рік:

2008

Мова:

english

Файл:

PDF, 1.40 MB

english, 2008

Investigation on Sn grain number and crystal orientation in the Sn–Ag–Cu/Cu solder joints of different sizes

Shihua Yang, Yanhong Tian, Chunqing Wang

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2010

Мова:

english

Файл:

PDF, 1020 KB

english, 2010

Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

Yanhong Tian, Wei Liu, Rong An, Wei Zhang, Lina Niu, Chunqing Wang

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2012

Мова:

english

Файл:

PDF, 2.99 MB

english, 2012

Ultrasonic Bondability and Antioxidation Property of Ti/Cu/TaN/Ag Multi-layers on Si Substrate

Chunjin Hang, Yanhong Tian, Chunqing Wang, Ning Wang

Журнал:

Thin Solid Films

Рік:

2012

Мова:

english

Файл:

PDF, 1.10 MB

english, 2012

Modeling of Micropitch Shift of a Magnetoelectrical Sensor During Laser Solder Ball Bonding Process

Dewen Tian, Chunqing Wang, Yanhong Tian

Журнал:

IEEE Transactions on Advanced Packaging

Рік:

2009

Мова:

english

Файл:

PDF, 847 KB

english, 2009

Molecular variability of sweet potato chlorotic stunt virus (SPCSV) and five potyviruses infecting sweet potato in China

Yanhong Qin, Zhenchen Zhang, Qi Qiao, Desheng Zhang, Yuting Tian, Yongjiang Wang

Журнал:

Archives of Virology

Рік:

2013

Мова:

english

Файл:

PDF, 249 KB

english, 2013

Formation of AuSnxIMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow processes

Wei Liu, Yanhong Tian, Chunqing Wang, Lining Sun

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2013

Мова:

english

Файл:

PDF, 948 KB

english, 2013

Microstructure and tribological properties of W-implanted PVD TiN coatings on 316L stainless steel

Tian, Bin, Yue, Wen, Fu, Zhiqiang, Gu, Yanhong, Wang, Chengbiao, Liu, Jiajun

Журнал:

Vacuum

Рік:

2014

Мова:

english

Файл:

PDF, 2.20 MB

english, 2014

Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

Chunjin Hang, Yanhong Tian, Rui Zhang…

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2013

Мова:

english

Файл:

PDF, 1.53 MB

english, 2013

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Prediction of Solder Joint geometry for Optical Fiber attachment Assembly in Direct-Coupling Applications

Zhang Wei,, Wang Chunqing,, Tian Yanhong,

Рік:

2005

Мова:

english

Файл:

PDF, 238 KB

english, 2005

Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid–liquid interdiffusion bonding

Yanhong Tian,Chunjin Hang,Xin Zhao…

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2014

Мова:

english

Файл:

PDF, 1.72 MB

english, 2014

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices

Yang, Lei, Liu, Wei, Wang, Chunqing, Tian, Yanhong

Рік:

2011

Мова:

english

Файл:

PDF, 1.97 MB

english, 2011

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Research on tensile property and creep resistance of electroplating nickel reinforced by A12O3 nanoparticles

Hang, Chunjin, Tian, Yanhong, Wang, Chunqing, Wang, Hong

Рік:

2014

Файл:

PDF, 656 KB

2014

[IEEE 4th World Congress on Intelligent Control and Automation - Shanghai, China (10-14 June 2002)] Proceedings of the 4th World Congress on Intelligent Control and Automation (Cat. No.02EX527) - A multi-agent and holonic approach for intelligent scheduling in agile manufacturing environments

Wang Yanhong,, Huang Fang,, Yin Caowan,, Tian Yantao,

Рік:

2002

Мова:

english

Файл:

PDF, 548 KB

english, 2002

Highly photosensitive thienoacene single crystal microplate transistors via optimized dielectric

Zhao, Xiaoli, Tang, Qingxin, Tian, Hongkun, Tong, Yanhong, Liu, Yichun

Журнал:

Organic Electronics

Рік:

2015

Мова:

english

Файл:

PDF, 1.26 MB

english, 2015

Impacts of climate change on the distribution of Sichuan snub-nosed monkeys ( Rhinopithecus roxellana ) in Shennongjia area, China

Luo, Zhenhua, Zhou, Surong, Yu, Wendi, Yu, Huiliang, Yang, Jingyuan, Tian, Yanhong, Zhao, Mian, Wu, Hua

Журнал:

American Journal of Primatology

Рік:

2015

Мова:

english

Файл:

PDF, 2.46 MB

english, 2015

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Synthesis of Sn-3.5Ag nanoparticles of tiny sizes

Zhi, Jiang, Su, Ding, Yanhong, Tian, Chunqing, Wang

Рік:

2014

Мова:

english

Файл:

PDF, 669 KB

english, 2014

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Laser ink-jet solder bump fabrication for electronic interconnection

Fuquan Li,, Chunqing Wang,, Yanhong Tian,

Рік:

2003

Мова:

english

Файл:

PDF, 235 KB

english, 2003

Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints

Li, Hailong, An, Rong, Wang, Chunqing, Tian, Yanhong, Jiang, Zhi

Журнал:

Materials Letters

Рік:

2015

Мова:

english

Файл:

PDF, 1.29 MB

english, 2015

Surface-Tension-Driven Self-Assembly of 3-D Microcomponents by Using Laser Reflow Soldering and Wire Limiting Mechanisms

Yang, Lei, Liu, Wei, Wang, Chunqing, Tian, Yanhong

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2013

Мова:

english

Файл:

PDF, 3.10 MB

english, 2013

Polyaniline-Reduced Graphene Oxide Hybrid Nanosheets with Nearly Vertical Orientation Anchoring Palladium Nanoparticles for Highly Active and Stable Electrocatalysis

Yang, Liming, Tang, Yanhong, Yan, Dafeng, Liu, Tian, Liu, Chengbin, Luo, Shenglian

Журнал:

ACS Applied Materials & Interfaces

Рік:

2015

Мова:

english

Файл:

PDF, 5.07 MB

english, 2015

One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices

Ding, Su, Jiu, Jinting, Gao, Yue, Tian, Yanhong, Araki, Teppei, Sugahara, Tohru, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Suganuma, Katsuaki, Uchida, Hiroshi

Журнал:

ACS Applied Materials & Interfaces

Рік:

2016

Мова:

english

Файл:

PDF, 4.42 MB

english, 2016

Reply to 'Do thermal effects cause the propulsion of bulk graphene material?'

Zhang, Tengfei, Chang, Huicong, Wu, Yingpeng, Xiao, Peishuang, Yi, Ningbo, Lu, Yanhong, Ma, Yanfeng, Huang, Yi, Zhao, Kai, Chen, Yongsheng, Yan, Xiao-Qing, Liu, Zhi-Bo, Tian, Jian-Guo

Журнал:

Nature Photonics

Рік:

2016

Мова:

english

Файл:

PDF, 138 KB

english, 2016

Sn–3.0Ag–0.5Cu nanocomposite solders reinforced by graphene nanosheets

Huang, Yilong, Xiu, Ziyang, Wu, Gaohui, Tian, Yanhong, He, Peng

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2016

Мова:

english

Файл:

PDF, 2.27 MB

english, 2016

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Microstructure of solar cell interconnections by resistance welding

Ji, Xiaoliang, An, Rong, Wang, Chunqing, Tian, Yanhong

Рік:

2016

Мова:

english

Файл:

PDF, 1.27 MB

english, 2016

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Facile preparation of sintered Cu-Ag bimetallic nanoparticle paste with low porosity

Zhi, Jiang, Yanhong, Tian, Huang, Yuan, Wen, Jiayue

Рік:

2016

Мова:

english

Файл:

PDF, 502 KB

english, 2016

Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress

Liu, Baolei, Tian, Yanhong, Qin, Jingkai, An, Rong, Zhang, Rui, Wang, Chenxi

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2016

Мова:

english

Файл:

PDF, 4.26 MB

english, 2016

Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Tian, Ruyu, Tian, Yanhong, Wang, Chenxi, Zhao, Liyou

Журнал:

Materials Science and Engineering: A

Рік:

2017

Мова:

english

Файл:

PDF, 2.37 MB

english, 2017

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - The Synthesis of Cu-Ag core-shell bimetallic nanoparticles for IC bonding

Wen, Jiayue, Tian, Yanhong

Рік:

2016

Мова:

english

Файл:

PDF, 3.36 MB

english, 2016

Generation of trophoblast-like cells from the amnion in vitro: A novel cellular model for trophoblast development

Wei, Yanxing, Zhou, Xiaohua, Huang, Wenhao, Long, Ping, Xiao, Lu, Zhang, Tian, Zhong, Mei, Pan, Guangjin, Ma, Yanlin, Yu, Yanhong

Журнал:

Placenta

Рік:

2017

Мова:

english

Файл:

PDF, 18.44 MB

english, 2017

A prediction method based on wavelet transform and multiple models fusion for chaotic time series

Zhongda, Tian, Shujiang, Li, Yanhong, Wang, Yi, Sha

Журнал:

Chaos, Solitons & Fractals

Рік:

2017

Мова:

english

Файл:

PDF, 2.11 MB

english, 2017

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low-temperature direct bonding of silicon to quartz glass wafer via sequential wet chemical surface activation

Wang, Chenxi, Xu, Jikai, Zeng, Xiaorun, Tian, Yanhong, Wang, Chunqing, Suga, Tadatomo

Рік:

2017

Файл:

PDF, 257 KB

2017

Effect of Stapling Architecture on Physiochemical Properties and Cell Permeability of Stapled α-Helical Peptides: a Comparative Study

Tian, Yuan, Jiang, Yanhong, Li, Jingxu, Wang, Dongyuan, Zhao, Hui, Li, Zigang

Журнал:

ChemBioChem

Рік:

2017

Мова:

english

Файл:

PDF, 2.06 MB

english, 2017

SVM predictive control for calcination zone temperature in lime rotary kiln with improved PSO algorithm

Zhongda, Tian, Shujiang, Li, Yanhong, Wang, Xiangdong, Wang

Журнал:

Transactions of the Institute of Measurement and Control

Рік:

2017

Мова:

english

Файл:

PDF, 1.16 MB

english, 2017